Chemical Mechanical Polishing/Planarization (CMP) slurries play an integral role in microchip fabrication. Polishing of the wafers between multiple depositions, photolithography and etching is vital to produce planar devices, yet each polishing stage risks potential wafer damage.
Characterising the size distribution of CMP slurry particles is of importance in determining the condition of CMP slurries before they are used in polishing tools, and also in investigating failures. Particle aggregation can be caused by settling in storage tanks, ageing of the slurry, or by shear as the slurry is pumped up to the CMP tool. Shifts in the size distribution can indicate the early onset of aggregation before large, hard aggregates are formed. As such the NanoSight instruments represent an ideal tool for monitoring the state of aggregation within a CMP slurry.
Download the CMP Slurries Application Note (Right Click, Save As)